Projekte von DKE/UK 631.4

IEC 47D/780/CDV 2009-02-06 EC 60191-2 f65 Ed.1: Propsed New Package Outline-PlasticBottom-landed Small Outline Non-lead Package(P-BSO-N2/3/4/5/6) Mehr  Kontakt zu DIN 
IEC 47D/714/DC 2008-03-21 Categorization of the loose leaves of IEC 60191-2 Specifications Mehr  Kontakt zu DIN 
IEC 47D/677/NP 2006-12-15 NP-PAS: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) Mehr  Kontakt zu DIN 
IEC 47D/674/NP 2006-11-24 Proposal of USNC: Proposed new package outline - 13 Pin reduced size MultiMediaCard (MMC) outline MMCmobile 18×24×1,4 mm (Intended to become IEC 60191-2/F65, if approved) Mehr  Kontakt zu DIN 
IEC 47D/675/NP 2006-11-24 Proposed new package outline - 10 pin micro size Multimedia Card (MMC) outline MMCmicro 14×12×1,1 mm (Intended to become IEC 60191-2/F66, if approved) Mehr  Kontakt zu DIN 
IEC 47D/676/NP 2006-11-24 Proposed new package outline - 13 Pin full size Multimedia Card (MMC) Outline MMCplus 32×24×1,4 mm (Intended to become IEC 60191-2/F67, if approved) Mehr  Kontakt zu DIN 
IEC 47D/671/CD 2006-11-03 NP-CD: (Future IEC 60191-6-14): General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) Mehr  Kontakt zu DIN 
IEC 47D/673/CD 2006-11-03 NP-CD: IEC 60191-6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) Mehr  Kontakt zu DIN 
IEC 47D/652/NP 2006-04-14 Design guide for semiconductor packages - Ball Grid Array Package (BGA) Mehr  Kontakt zu DIN 
IEC 47D/653/NP 2006-04-14 Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA) Mehr  Kontakt zu DIN