Projekte von DKE/UK 631.4

IEC 47D/647/CD 2006-02-17 IEC 60191-2/f64, Ed 1: Proposed new package outline - Small outline package (SOT) 3-, 5- and 6-Lead SMD (to be published as 182E outline) Mehr  Kontakt zu DIN 
IEC 47D/713/FDIS 2005-07-15 IEC 60191-2/F63/Ed. 1: Proposed new package outline - Power Package with 34 Pins (to be published as Outline 181E) Mehr  Kontakt zu DIN 
IEC 47D/590/DC 2004-08-27 Proposed SC47D Scope Change (document also of interest to TC 48) Mehr  Kontakt zu DIN 
IEC 47D/539A/NP 2004-01-30 RESUBMISSION: Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch (ex 47D/539/NP) Mehr  Kontakt zu DIN 
IEC 47D/576/NP 2004-01-30 Proposed IEC 60191-6-xx: Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA Mehr  Kontakt zu DIN 
IEC 47D/539/NP 2003-04-11 Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch Mehr  Kontakt zu DIN 
IEC 47D/540/NP 2003-04-11 Proposed new package outline, Plastic, small outline family, 1,27 mm pitch, 7,5 mm body width and 14, 16, 18, 20, 24 and 28 lead counts Mehr  Kontakt zu DIN 
IEC 47D/542/NP 2003-04-11 Proposed new package outline, Plastic small outline family, 1,27 mm pitch, 3,9 mm body width, 8, 14 and 16 leads Mehr  Kontakt zu DIN 
IEC 47D/543/NP 2003-04-11 Proposed new package outline, Plastic small outline family, 25 mil pitch, 150 mil body width, 14, 16, 18, 20, 24 and 28 leads Mehr  Kontakt zu DIN 
IEC 47D/523/NP 2002-11-22 Proposed new package outline for P-DHVQFN family. (Plastic Dual in-line compatible Heatsink Very thin Quad Flat Pack No Leads). If approved, to be included in IEC 60191-2 serie Mehr  Kontakt zu DIN 

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