Projekt
Proposed new package outline for P-DHVQFN family. (Plastic Dual in-line compatible Heatsink Very thin Quad Flat Pack No Leads). If approved, to be included in IEC 60191-2 serie
Beginn
2002-11-22
Geplante Dokumentnummer
IEC 47D/523/NP
Zuständiges nationales Arbeitsgremium
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
