Projekte von DKE/UK 631.4

IEC 47D/252/NP 1998-11-13 Proposal of the Japanese NC: BGA (Ball Grid Array) package measuring method Mehr  Kontakt zu DIN 
IEC 47D/229/NP 1998-07-17 Proposal of the USNC: Common package unit design guide for BGA packages Mehr  Kontakt zu DIN 
IEC 47D/214/NP 1998-02-06 Proposal of the Japanese NC: The individual standard for 0,8 mm pitch plastic fine pitch ball grid array (P-FBGA) family (Intended for inclusion into IEC 191-2) Mehr  Kontakt zu DIN 
IEC 47D/314/CD 1998-02-06 Tape Ball Grid Array package, 0.6 mm ball diameter family (Intended for inclusion in 60191-2) Mehr  Kontakt zu DIN 
IEC 47D/210/NP 1998-02-06 Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2) Mehr  Kontakt zu DIN 
IEC 47D/211/NP 1998-02-06 Proposal of the Japanese NC: The individual standard for 32&48 pins plastic fine pitch ball grid array (P-FBGA), 0,8 mm terminal pitch (Intended for inclusion into IEC 191-2) Mehr  Kontakt zu DIN 
IEC 47D/213/NP 1998-02-06 Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2) Mehr  Kontakt zu DIN 
IEC 47D/163A/CDV 1997-09-12 Proposed modification of wire ended diode (intended for inclusion into IEC 60191-2) Mehr  Kontakt zu DIN 
IEC 47D/170/CDV 1997-04-04 IEC 191-6: General rules for TSOP (Thin Small Outline Package) Type II Mehr  Kontakt zu DIN 
IEC 47D/112/CD 1996-04-19 Proposal for a heat sink small outline (HSOP) family, similar to SOP family 075E contained in IEC 191-2 Mehr  Kontakt zu DIN 

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