Projekte von DKE/K 631

IEC 47F/127/CD 2012-08-10 IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials Mehr  Kontakt zu DIN 
IEC 47F/128/CD 2012-08-10 IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates Mehr  Kontakt zu DIN 
IEC 47F/126/CD 2012-08-03 IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass Mehr  Kontakt zu DIN 
IEC 47F/125/CD 2012-07-27 IEC 62047-16, Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods Mehr  Kontakt zu DIN 
IEC 47/2155/CDV 2012-03-02 Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 28: Prüfung der Empfindlichkeit gegen elektrostatische Entladungen (ESD) - Direct Contact Charged Device Model (DC-CDM) Mehr  Kontakt zu DIN 
IEC 47F/106/NP 2011-09-30 Future IEC 62047-15: Semiconductor devices Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass Mehr  Kontakt zu DIN 
IEC 47F/107/NP 2011-09-30 Future IEC 62047-16: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods Mehr  Kontakt zu DIN 
IEC 47F/105/NP 2011-09-30 Future IEC 62047-23: Semiconductor devices - Micro-electromechanical devices - Part 23: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods Mehr  Kontakt zu DIN 
IEC 47F/95/NP 2011-07-29 Future IEC 62047-21: Semiconductor devices - Micro-electromechanical devices Part 21: Test method for Poisson's ratio of thin film MEMS materials Mehr  Kontakt zu DIN 
IEC 47F/96/NP 2011-07-29 Future IEC 62047-22: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates Mehr  Kontakt zu DIN