Projekt
Future IEC 62047-15: Semiconductor devices Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
Beginn
2011-09-30
Geplante Dokumentnummer
IEC 47F/106/NP
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente
