Projekt
IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Beginn
2012-08-10
Geplante Dokumentnummer
IEC 47F/128/CD
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente
