Projekte von IEC/TC 47

IEC 47/2052/CDV 2008-05-09 Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 40: Prüfverfahren zum Fall einer Leiterplatte unter Verwendung von Dehnungsmessstreifen Mehr  Kontakt zu DIN 
IEC 47/1973/NP 2008-05-09 PNW 47-1973: Transmission line pulse measurement of human body model parameters for electrostatic discharge protection design of semiconductor devices Mehr  Kontakt zu DIN 
IEC 47/1967/DC 2008-04-04 Proposed transfer of Technical Report, IEC/TR 62380 Ed. 1, to IEC/TC 56 (Dependability) Mehr  Kontakt zu DIN 
IEC 47/2085/FDIS 2008-01-25 Halbleiter-Chip-Erzeugnisse - Teil 2: Datenaustausch-Formate Mehr  Kontakt zu DIN 
IEC 47/1911A/DC 2007-06-15 Proposal of the French NC: Reliability engineering in electronics(Numbering of clauses/paragraphs) Mehr  Kontakt zu DIN 
IEC 47/1905/NP 2007-03-30 Proposal of the Korean NC: (Future IEC 62047-7): Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS FBAR Filter & Duplexer Mehr  Kontakt zu DIN 
IEC 47/1907/NP 2007-03-30 Proposal of the Korean NC: (Future IEC 62047-9): Semiconductor devices - Micro-electromechanical devices - Part 9: Bonding strength measurement in MEMS packaging Mehr  Kontakt zu DIN 
IEC 47/1906/NP 2007-03-30 Proposal of the Korean NC: (Future IEC 62047-8): Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films Mehr  Kontakt zu DIN 
IEC 47/1881/NP 2006-07-28 Proposal of the French NC: Audit for obsolescence management Mehr  Kontakt zu DIN 
IEC 47/1868/NP 2006-05-26 (Future IEC 62047-6): Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials Mehr  Kontakt zu DIN