Projekt
Proposal of the Korean NC: (Future IEC 62047-8): Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Beginn
2007-03-30
Geplante Dokumentnummer
IEC 47/1906/NP
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente
