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Projekte von DKE/UK 631.4

IEC 47D/539A/NP 2004-01-30 RESUBMISSION: Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch (ex 47D/539/NP) Mehr  Kontakt zu DIN 
IEC 47D/576/NP 2004-01-30 Proposed IEC 60191-6-xx: Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA Mehr  Kontakt zu DIN 
IEC 47D/539/NP 2003-04-11 Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch Mehr  Kontakt zu DIN 
IEC 47D/540/NP 2003-04-11 Proposed new package outline, Plastic, small outline family, 1,27 mm pitch, 7,5 mm body width and 14, 16, 18, 20, 24 and 28 lead counts Mehr  Kontakt zu DIN 
IEC 47D/542/NP 2003-04-11 Proposed new package outline, Plastic small outline family, 1,27 mm pitch, 3,9 mm body width, 8, 14 and 16 leads Mehr  Kontakt zu DIN 
IEC 47D/543/NP 2003-04-11 Proposed new package outline, Plastic small outline family, 25 mil pitch, 150 mil body width, 14, 16, 18, 20, 24 and 28 leads Mehr  Kontakt zu DIN 
IEC 47D/523/NP 2002-11-22 Proposed new package outline for P-DHVQFN family. (Plastic Dual in-line compatible Heatsink Very thin Quad Flat Pack No Leads). If approved, to be included in IEC 60191-2 serie Mehr  Kontakt zu DIN 
IEC 47D/589/FDIS 2002-04-12 IEC 60191-2, F56, Ed.1: (will become IEC 60191-2/A11/Ed.1): Proposed new package outline, 5-leaded Power SMD (Outline 176E-a) Mehr  Kontakt zu DIN 
IEC 47D/503/NP 2002-04-12 Proposed new package outline, 3/4-land SMD (If approved, to be included in IEC 60191-2) Mehr  Kontakt zu DIN 
IEC 47D/435/FDIS 2001-05-11 IEC 60191-2, F41, Ed.1: Proposal for a supplement of QFN outline drawings to the outline family of 102E Mehr  Kontakt zu DIN 

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