DIN Standards Committee Materials Testing
Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation
Abstract
This document serves as a guide for users to select a suitable method for determining the thermal conductivity of substances used in electronic applications for heat dissipation. Many methods, some very different, have been developed for determining the thermal conductivity of materials. While some of these methods are predestined for use with certain substances or end-use applications, the same methods may be inappropriate for other substances or end-use applications. This document provides guidance to users on the suitability of these procedures. The substances considered in this document are: - Adhesives; • Potting compounds; • Pastes; • Films and foils; • varnishes (so-called "heat spreaders"); • precured or reactive "gap fillers".
Begin
2022-05-27
Planned document number
DIN 50003
Project number
06236120
Responsible national committee
NA 062-10-03 AA - Adhesive bondings in electronic applications
draft standard
Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation
2023-08
Order from DIN Media
