NA 062

DIN Standards Committee Materials Testing

Project

Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation

Abstract

This document serves as a guide for users to select a suitable method for determining the thermal conductivity of substances used in electronic applications for heat dissipation. Many methods, some very different, have been developed for determining the thermal conductivity of materials. While some of these methods are predestined for use with certain substances or end-use applications, the same methods may be inappropriate for other substances or end-use applications. This document provides guidance to users on the suitability of these procedures. The substances considered in this document are: - Adhesives; • Potting compounds; • Pastes; • Films and foils; • varnishes (so-called "heat spreaders"); • precured or reactive "gap fillers".

Begin

2022-05-27

Planned document number

DIN 50003

Project number

06236120

Responsible national committee

NA 062-10-03 AA - Adhesive bondings in electronic applications 

Contact

Dr.

Nicole Kroll

Am DIN-Platz, Burggrafenstr. 6
10787 Berlin

Tel.: +49 30 2601-2028
Fax: +49 30 2601-42028

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