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Projekte von DKE/K 682

IEC 91/469/NP 2004-07-02 Specification for Flexible Optical Board using Glass Fibre and its test methods Mehr  Kontakt zu DIN 
IEC 91/470/NP 2004-07-02 Specification for rigid optical board using planar waveguide and its test methods Mehr  Kontakt zu DIN 
IEC 91/471/NP 2004-07-02 Specification for optical board connector type SF using glass fibre Mehr  Kontakt zu DIN 
IEC 91/432/NP 2003-10-17 IEC xxx-xx: Test methods for lead-free solders - Part 1: Measurement of melting temperature ranges Mehr  Kontakt zu DIN 
IEC 91/433/NP 2003-10-17 IEC xxx-xx: Test methods for lead-free solder - Part 2: Testing of mechanical characteristics Mehr  Kontakt zu DIN 
IEC 91/407/NP 2003-07-11 IEC 61188-5-7 Design and use of printed boards and printed board assemblies - Part 5-7: Sectional requirements attachment (land/joint) considerations - components with post mounting leads on two sides (dips) Mehr  Kontakt zu DIN 
IEC 91/405/NP 2003-07-11 IEC 61249-1-1: Materials for printed boards and other interconnection structures - Part 1-1: Safety certification of base materials for rigid printed circuit boards Mehr  Kontakt zu DIN 
IEC 91/378/NP 2003-03-07 IEC 61190-1-6: Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications Mehr  Kontakt zu DIN 
IEC 91/379/NP 2003-03-07 IEC 61190-1-7: Attachment materials for electronic assembly - Part-1-7: Requirements for lead free solder pastes for high quality interconnections in electronics assembly Mehr  Kontakt zu DIN 
IEC 107/18/CD 2002-01-18 Luftfahrtelektronik-Prozessmanagement - Technische Spezifikation für die Erarbeitung des Managementplanes für elektronische Bauelemente (IEC 107/18/CD:2002) Mehr  Kontakt zu DIN 

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