• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Publications of DKE/K 682

DIN EN IEC 61189-2-501 2023-12 Standards Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022); German version EN IEC 61189-2-501:2022 More  Order from DIN Media
DIN EN IEC 61189-2-630 2019-03 Standards Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018); German version EN IEC 61189-2-630:2018 More  Order from DIN Media
DIN EN IEC 61189-2-720 2025-01 Standards Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 61189-2-720:2024); German version EN IEC 61189-2-720:2024 More  Order from DIN Media
DIN EN IEC 61189-2-801 2024-08 Standards Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 61189-2-801:2023); German version EN IEC 61189-2-801:2023 More  Order from DIN Media
DIN EN IEC 61189-2-803 2024-08 Standards Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023 More  Order from DIN Media
DIN EN IEC 61189-2-804 2024-10 Standards Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 61189-2-804:2023); German version EN IEC 61189-2-804:2023 More  Order from DIN Media
DIN EN IEC 61189-2-805 2025-08 Standards Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA (IEC 61189-2-805:2024); German version EN IEC 61189-2-805:2024 More  Order from DIN Media
DIN EN IEC 61189-2-807 2023-01 Standards Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021); German version EN IEC 61189-2-807:2021 More  Order from DIN Media
DIN EN IEC 61189-2-808 2025-08 Standards Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (IEC 61189-2-808:2024); German version EN IEC 61189-2-808:2024 More  Order from DIN Media
DIN EN IEC 61189-2-809 2025-11 Standards Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA (IEC 61189-2-809:2024); German version EN IEC 61189-2-809:2025 More  Order from DIN Media

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