DIN EN IEC 61189-2-804
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 61189-2-804:2023); German version EN IEC 61189-2-804:2023
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-804: Prüfverfahren für die Zeit bis zur Delaminierung - T260, T288, T300 (IEC 61189-2-804:2023); Deutsche Fassung EN IEC 61189-2-804:2023
Overview
This part of IEC 61189 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260°C, 288°C and 300ºC, but are not limited to these values. Its application increases investment security for manufacturers and users, and provides testing laboratories and manufacturers with defined information for testing.
Document: references other documents
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
