DIN EN IEC 61189-2-803
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-803: Prüfverfahren für die Z-Achsen-Ausdehnung von Basismaterialien und Leiterplatten (IEC 61189-2-803:2023); Deutsche Fassung EN IEC 61189-2-803:2023
Overview
This part of IEC 61189 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA). There are no restrictions on the scope of application of the document. Its application increases investment security for manufacturers and users, provides testing laboratories and manufacturers with defined information for testing, and increases product compatibility between manufacturers.
Document: references other documents
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
