DIN EN IEC 61189-2-805
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA (IEC 61189-2-805:2024); German version EN IEC 61189-2-805:2024
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-805: X/Y CTE Prüfung für dünne Basismaterialien mit TMA (IEC 61189-2-805:2024); Deutsche Fassung EN IEC 61189-2-805:2024
Overview
This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur. This document deals with: test specimens, testing equipment and accessories, procedures, evaluation, and test reports. There are no restrictions on the scope of application of this document. Application of this document enhances investment security for manufacturers and users, provides testing laboratories and manufacturers with concrete information for testing, and improves product compatibility across manufacturers.
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
