DIN EN IEC 61189-2-809
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA (IEC 61189-2-809:2024); German version EN IEC 61189-2-809:2025
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-809: Prüfung des X/Y-Wärmeausdehnungskoeffizienten (CTE) für dicke Grundwerkstoffe mittels TMA (IEC 61189-2-809:2024); Deutsche Fassung EN IEC 61189-2-809:2025
Overview
This document defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur. This document covers: test specimens, testing equipment, test procedures, calculations, and test reports. Application of this document increases investment security for manufacturers and users and provides testing laboratories and manufacturers with defined information for testing.
Document: references other documents
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
