NA 062
DIN Standards Committee Materials Testing
DIN 54451 [Withdrawn] referenced in following documents:
| Document number | Edition | Title |
|---|---|---|
| VDI/VDE 2251 Blatt 8 | 2007-09 | Precision engineering components - Adhesive connections More |
| DIN 65074 | 1999-03 | Aerospace - Adhesive films and primers for structural assemblies - Technical specification More |
| DKI i 007 | 1997-03 | Bonding of copper and copper alloys More |
| DVS 3304 | 1994-07 | Klebfachkraft - Aufbaumodul - Kunststoffkleben More |
| WL 5.4110 | 1998-10 | Aerospace series - Structural adhesive films on a modified EP basis - Standard curing temperature 125 °C, applicable from - 55 °C to 80 °C More |
| WL 5.4111 | 1998-10 | Aerospace - Structural adhesive films on a modified EP basis - Standard curing temperature 175 °C, applicable from - 55 °C to 135 °C More |
