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Projekte von IEC/TC 91

IEC 91/692/NP 2007-06-15 Proposal from Chinese NC: Future IEC 61249-2-42: Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass resinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly Mehr  Kontakt zu DIN 
IEC 91/615/NP 2006-07-21 Proposal of the JPNC: NP-PAS - Performance guide for single- and double-sided flexible printed wiring boards Mehr  Kontakt zu DIN 
IEC 91/616/NP 2006-07-21 Proposal of the JPNC: NP-PAS - Copper-Clad Laminate for Flexible Printed Wiring Boards (Adhesive and Non-adhesive types) Mehr  Kontakt zu DIN 
IEC 91/642/CDV 2006-07-14 IEC 62468 Ed.1 : The marking for the presence and absence of the specified chemical substances in materials, components and mounted boards used in electrical and electronic equipment Mehr  Kontakt zu DIN 
IEC 91/663/CDV 2006-04-28 NP-CDV: IEC 61249-4-14, Ed. 1: Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly Mehr  Kontakt zu DIN 
IEC 91/592/NP 2006-04-28 IEC 61249-4-15: Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly Mehr  Kontakt zu DIN 
IEC 91/594/NP 2006-04-28 IEC 61249-4-16: Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly Mehr  Kontakt zu DIN 
IEC 91/595/NP 2006-04-28 IEC 61249-4-17: Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly Mehr  Kontakt zu DIN 
IEC 91/596/NP 2006-04-28 IEC 61249-2-36: Materials for printed boards and other interconnecting structures - Part 2-36: Sectional specification set for reinforced based materials, clad and unclad - Epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly Mehr  Kontakt zu DIN 
IEC 91/597/NP 2006-04-28 IEC 61249-2-37: Materials for printed boards and other interconnecting structures - Part 2-37: Sectional specification set for reinforced based materials, clad and unclad - Multi-functional, non-halogenated epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly Mehr  Kontakt zu DIN 

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