NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Thermal standardization on semiconductor packages - Part 2-3: 3D thermal simulation models of semiconductor packages for steady-state analysis - LQFP packages
Abstract
This part of IEC 63378 specifies three-dimensional (3D) thermal model of LQFP (Low-profile Quad Flat Package), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.The package whose center coordinates of the die matches those of the package, viewing from the top, is within the scope.The package whose die pad sink amount is less than the thickness of the die pad is out of the scope.This model is intended to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
Begin
2026-08-13
Planned document number
DIN EN IEC 63378-2-3
Project number
02234083
