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Draft standard [Pre-order]

DIN EN IEC 63378-3
Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis (IEC 63378-3:2025); German version EN IEC 63378-3:2025

Title (German)

Thermische Standardisierung von Halbleitergehäusen - Teil 3: Thermische Schaltungssimulationsmodelle von diskreten Halbleitergehäusen für die Transientenanalyse (IEC 63378-3:2025); Deutsche Fassung EN IEC 63378-3:2025

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente  

Edition 2026-08
Publication 2026-07-03
Public enquiry period 2026-07-03
until
2026-09-03
Original language German
Price from 97.40 €
Order from DIN Media
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