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Projekte von DKE/K 682

IEC 91/563/NP 2005-10-07 Future IEC 61249-2-35: Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly Mehr  Kontakt zu DIN 
IEC 91/554/CD 2005-09-02 IEC 60068-2-20 Ed. 5: Basic environmental testing procedures: Part 2: Tests - Test T: Test methods for solderability and resistance to soldering heat of leaded devices Mehr  Kontakt zu DIN 
IEC 40/1605/NP 2005-08-26 IEC 60286-3-X: Packaging of components for automatic handling Part X: Packaging of surface mount components on continuous press carrier tapes Mehr  Kontakt zu DIN 
IEC 107/45/DC 2005-06-24 Lead-free electronics in aerospace Mehr  Kontakt zu DIN 
IEC 91/530/NP 2005-06-24 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint. Part 3: Cyclic drop test Mehr  Kontakt zu DIN 
IEC 91/531/NP 2005-06-24 The marking for presence and non-presence of the specified chemical substance in materials, components and mounted boards use in electrical and electronic equipment Mehr  Kontakt zu DIN 
IEC 91/532/NP 2005-06-24 Environmental Testing - Part X: Tests - Test: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste Mehr  Kontakt zu DIN 
IEC 107/29/CD 2004-11-12 Prozessmanagement für die Luftfahrtindustrie - Norm für die Akkommodation von atmosphärischen Strahlungseffekten über Einzelereignis-Effekte innerhalb elektronischer Luftfahrtausrüstungen (IEC 107/29/CD:2004) Mehr  Kontakt zu DIN 
IEC 91/486/NP 2004-09-10 Detail Specification for Right-angled Optical Board Connector using Glass Fibers Mehr  Kontakt zu DIN 
IEC 91/476/NP 2004-08-20 Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices Mehr  Kontakt zu DIN 

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