Project
Thermal standardization on semiconductor packaging - Part 3: Thermal circuit simulation models of semiconductor packages for transient analysis
Abstract
This part of IEC 63378 specifies the thermal circuit network model of discrete (TO-243, TO-252 and TO-263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification. This model is assumed to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.
Begin
2025-04-23
Planned document number
DIN EN IEC 63378-3
Project number
02233061
