• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 682

DIN EN IEC 63215-5 2022-02-22 Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English More  Comment 
DIN EN IEC 62668-1/A1 2021-12-23 Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components (IEC 107/387/CD:2021); Text in German and English More  Comment 
DIN EN IEC 61189-2-809 2021-08-05 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English More  Comment 
DIN EN IEC 61188-6-3 2021-01-06 Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English More  Comment 
DIN EN IEC 61189-2-805 2021-01-05 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English More  Comment 
DIN EN IEC 61189-2-808 2020-12-10 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English More  Comment 
DIN EN IEC 63215-2 2020-10-12 Endurance test methods for die attach materials applied to power electronics devices - Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices (IEC 91/1660/CD:2020); Text in German and English More  Comment 
DIN EN IEC 63251 2020-01-07 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (IEC 63251:2023); German version EN IEC 63251:2023 More  Comment 
DIN EN IEC 61189-2-801 2019-01-09 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 61189-2-801:2023); German version EN IEC 61189-2-801:2023 More  Comment 
DIN EN IEC 61189-2-803 2019-01-09 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023 More  Comment 

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