• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/UK 631.4

IEC 47D/211/NP 1998-02-06 Proposal of the Japanese NC: The individual standard for 32&48 pins plastic fine pitch ball grid array (P-FBGA), 0,8 mm terminal pitch (Intended for inclusion into IEC 191-2) More  Comment 
IEC 47D/213/NP 1998-02-06 Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2) More  Comment 
IEC 47D/163A/CDV 1997-09-12 Proposed modification of wire ended diode (intended for inclusion into IEC 60191-2) More  Comment 
IEC 47D/170/CDV 1997-04-04 IEC 191-6: General rules for TSOP (Thin Small Outline Package) Type II More  Comment 
IEC 47D/112/CD 1996-04-19 Proposal for a heat sink small outline (HSOP) family, similar to SOP family 075E contained in IEC 191-2 More  Comment 
IEC 47D/201/CDV 1996-04-05 IEC 60191-2: Proposal for a plastic thin shrink small outline package (TSSOP/HTSSOP), 1,00 mm lead length outline family, R-PDSO-G More  Comment 
IEC 47D/283/FDIS 1995-09-22 IEC 60191-2: Plastic small outline family, J-leads (P-SOJ), 10,16 mm body family (to be published as outline 141E-d) More  Comment 
IEC 47D/284/FDIS 1995-09-22 IEC 60191-2: Plastic thin small outline package P-TSOP-II, 7,62 mm body family More  Comment 
IEC 47D/285/FDIS 1995-09-22 IEC 60191-2: P-TSOP-II, 10,16 mm body family (if approved, to be included in outline 139E) More  Comment 
IEC 47D/286/FDIS 1995-09-08 IEC 60191-2: HSOP, reverse bend, heatslug up More  Comment 

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