Project
IEC 60191-2: Plastic thin small outline package P-TSOP-II, 7,62 mm body family
Abstract
The document specifies a plastic thin small package P-TSOP II, 7,62 mm body family.
Begin
1995-09-22
Planned document number
IEC 47D/284/FDIS
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
