Project
IEC 60191-2: Proposal for a plastic thin shrink small outline package (TSSOP/HTSSOP), 1,00 mm lead length outline family, R-PDSO-G
Abstract
This document specifies the dimensions of the Plastic Thin Shrink Small Outline Package (SSOP), 1,00 mm lead length, outline family, R-PDSO-G.
Begin
1996-04-05
Planned document number
IEC 47D/201/CDV
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
