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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of IEC/TC 91

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IEC 91/997/NP	2011-09-02	Future IEC 62326-17; Printed boards-Device Embedded Substrate-TEG(test element group) More	Comment
IEC 91/998/NP	2011-09-02	Future IEC 62326-18: Printed boards-Device Embedded Substrate-Test Method More	Comment
IEC 91/999/NP	2011-09-02	Future IEC 62326-19: Printed boards-Device Embedded Substrate-Design Guide More	Comment
IEC 91/995/CD	2011-08-26	IEC 62326-15: Printed boards - Device Embedded Substrate - General electrical test guide for device embedded substrate with active devices, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages. More	Comment
IEC 91/987/CD	2011-07-15	Test method for erosion of wave soldering equipments by molten lead free solder alloy-Part 1: Erosion test method for the metallic material without surface treatment More	Comment
IEC 91/965/NP	2011-02-18	Future IEC 61760-4 Ed.1: Classification, packaging, labelling and handling of moisture sensitive devices More	Comment
IEC 91/968/NP	2011-02-18	Test method for erosion by molten lead free solder. More	Comment
IEC 91/952/DC	2010-10-01	Review and Maintenance - call for comments/ proposals onpublications coming up for review and a call for experts More	Comment
IEC 91/972/CDV	2010-09-24	IEC 61249-4-18: Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly More	Comment
IEC 91/973/CDV	2010-09-24	IEC 61249-4-19: Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly More	Comment

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