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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Publications of DKE/K 682

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DIN EN IEC 62878-2-603	2023-07	Draft standard	Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English More	Order from DIN Media
DIN EN IEC 63215-2	2021-01	Draft standard	Endurance test methods for die attach materials applied to power electronics devices - Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices (IEC 91/1660/CD:2020); Text in German and English More	Order from DIN Media
DIN EN IEC 63215-5	2022-06	Draft standard	Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English More	Order from DIN Media
DIN EN IEC 63251 ; VDE 0885-201:2020-05	2020-05	Draft standard	Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress (IEC 91/1626/CD:2019); Text in German and English More	Order from DIN Media
DIN IEC/TS 62647-1 ; DIN SPEC 42647-1:2013-07	2013-07	Technical Specification	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan (IEC/TS 62647-1:2012) More	Order from DIN Media
DIN IEC/TS 62647-2 ; DIN SPEC 42647-2:2013-09	2013-09	Technical Specification	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC/TS 62647-2:2012) More	Order from DIN Media
DIN IEC 60249-3-3	1994-06	Standards	Base materials for printed circuits; part 3: special materials; specification No. 3: permanent polymer coating materials (solder-resist) for use in the fabrication of printed boards; identical with IEC 60249-3-3:1991 More	Order from DIN Media

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