Publications of NA 022

DIN EN 60191-6-13 2017-06 Standards Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016 More  Order from DIN Media
DIN EN 60191-6-16 2007-11 Standards Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007 More  Order from DIN Media
DIN EN 60191-6-17 2011-09 Standards Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011 More  Order from DIN Media
DIN EN 60191-6-18 2010-08 Standards Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010 More  Order from DIN Media
DIN EN 60191-6-19 2010-10 Standards Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010 More  Order from DIN Media
DIN EN 60191-6-20 2011-03 Standards Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010 More  Order from DIN Media
DIN EN 60191-6-21 2011-03 Standards Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010 More  Order from DIN Media
DIN EN 60191-6-22 2013-08 Standards Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013 More  Order from DIN Media
DIN EN 60192 2002-03 Standards Low-pressure sodium vapour lamps - Performance specifications (IEC 60192:2001); German version EN 60192:2001 More  Order from DIN Media
DIN EN 60195 2017-02 Standards Method of measurement of current noise generated in fixed resistors (IEC 60195:2016); German version EN 60195:2016 More  Order from DIN Media

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