DIN EN 60191-6-18
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
Mechanische Normung von Halbleiterbauelementen - Teil 6-18: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Ball-Grid-Array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); Deutsche Fassung EN 60191-6-18:2010
Overview
The DIN EN 60191-6 standard series is based on the corresponding IEC 60191-6 series of International standards. It defines rules for outline drawings of surface mounted semiconductor device packages of varying package and terminal designs which are used during computer supported design and manufacturing processes. This part of DIN EN 60191 contains standard outline drawings, dimensions and recommended variations for all square ball grid array packages (BGA packages), whose terminal pitch is one millimetre or larger. Furthermore, the terminal position numbering is specified. Listing of recommended variations shall result in reducing the wide variety of user-specific designs of the BGA packages on the market. The responsible Committee is Subcommittee UK 631.4 "Gehäuse für Halbleiterbauelemente" ("Packages for semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
