DIN EN 60191-6-19
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010
Mechanische Normung von Halbleiterbauelementen - Teil 6-19: Messverfahren für die Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung (IEC 60191-6-19:2010); Deutsche Fassung EN 60191-6-19:2010
Overview
Within the framework of technical developments, packages for semiconductor devices have become increasingly flatter and finer. Heat exposure during the soldering process can, within the framework of the manufacture of electronic components, result in warpage of such packages, which then have a negative influence on the electrical contacts and thus on the functionality of electronic components. This part of DIN EN 60191 stipulates the package warpage measurement methods at an elevated temperature and the maximum permissible warpage for ball grid array (BGA), fine-pitch ball grid array (FBGA), and fine pitch land grid array (FLGA). The responsible Committee is Subcommittee UK 631.4 "Gehäuse für Halbleiterbauelemente" ("Packages for semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
