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IEC 55/1255/CD
IEC 60317-36 Ed. 2.0: Specifications for particular types of winding wires - Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
IEC 55/1247/CD
IEC 60317-37 Ed. 2.0: Specifications for particular types of winding wires - Part 37: Polyesterimide enamelled round copper wire, class 180, with a bonding layer
IEC 55/1247A/CD
IEC 60317-37 Ed. 2.0: Specifications for particular types of winding wires - Part 37: Polyesterimide enamelled round copper wire, class 180, with a bonding layer
IEC 55/1310/CDV
IEC 60317-38/Ed2: Specifications for particular types of winding wires - Part 38: Polyester or polyesterimide overcoated with polyamide-imide, enamelled round copper wire, class 200, with a bonding layer
IEC 55/1249/CD
IEC 60317-38 Ed. 2.0: Specifications for particular types of winding wires - Part 38: Polyester or polyesterimide overcoated with polyamide-imide, enamelled round copper wire, class 200, with a bonding layer
IEC 55/1249A/CD
IEC 60317-38 Ed. 2.0: Specifications for particular types of winding wires - Part 38: Polyester or polyesterimide overcoated with polyamide-imide, enamelled round copper wire, class 200, with a bonding layer
IEC 47F/31/CDV
IEC 62047-9,Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
ISO/IEC JTC 1/SC 25/ahG 1
Bonding adhoc
NA 087-00-12-01 UA
Ahesive bonding
NA 092-00-28-01 AK -dormant
Adhesive bonding process chain
