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Standards [CURRENT]

CSA C22.2 No. 0.4-17

Bonding of electrical equipment
Edition 2017-04-01

Standards [CURRENT]

IPC HDBK-4691

Handbook on Adhesive Bonding in Electronic Assembly Operations
Edition 2015-11-01

Standards [CURRENT]

IPC 4203B

Cover and Bonding Material for Flexible Printed Circuitry
Edition 2018-03-01

Standards [CURRENT]

IPC TR-001

An Introduction to Tape Automated Bonding Fine Pitch Technology
Edition 1989-01

Standards [CURRENT]

CSA C22.2 No. 41

Grounding and bonding equipment (Trinational standard with NMX-J-590- ANCE and UL 467)
Edition 2022-04-01

Standards [CURRENT]

DIN EN 62047-9

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
Edition 2012-03

Standards [CURRENT]

CSA ISO/IEC 30129

Information technology - Telecommunications bonding networks for buildings and other structures (Adopted ISO/IEC 30129:2015, first edition, 2015-10)
Edition 2020-03-01

Standards [CURRENT]

CSA ISO/IEC 30129A AMD 1

Amendment 1:2020 to CSA ISO/IEC 30129:20, Information technology - Telecommunications bonding networks for buildings and other structures (Adopted amendment 1:2019 to ISO/IEC 30129:2015)
Edition 2020

Standards [CURRENT]

AS 1882

Earth and bonding clamps
Edition 2002

Standards [CURRENT]

SAE AIR 4844C

Composites and Metal Bonding Glossary
Edition 2017-06-20

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