NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62137 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61190-1-2 | 2002-03 | Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly More |
| IEC 61190-1-3 | 2002-03 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More |
| IEC 61760-1 | 1998-08 | Surface mounting technology - Part 1: Standard method for the specification for surface mounting components (SMDs) More |