NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN 62137 [Withdrawn] references following documents:

Document number Edition Title
IEC 61190-1-2 2002-03 Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly More 
IEC 61190-1-3 2002-03 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More 
IEC 61760-1 1998-08 Surface mounting technology - Part 1: Standard method for the specification for surface mounting components (SMDs) More