NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61188-6-3 [Pre-order] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60352-5 | 2020-07 | Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance More |
| IEC 60194-2 | 2025-02 | Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies More |
| IEC 61188-6-2 | 2021-02 | Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) More |
| IEC 61191-1 | 2018-09 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies More |
| IEC 61191-2 | 2017-05 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies More |
| IEC 61191-3 | 2017-05 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies More |
| IEC 61191-4 | 2017-07 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies More |
| IEC/TR 61760-3-1 | 2022-06 | Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering - Guidelines for through hole diameter design with solder paste surface printing method More |
