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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Technical rule [CURRENT]

IEC/TR 61760-3-1
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering - Guidelines for through hole diameter design with solder paste surface printing method

Edition 2022-06

Original language English

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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC/TR 61760-3-1 Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering - Guidelines for through hole diameter design with solder paste surface printing method

IEC/TR 61760-3-1
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering - Guidelines for through hole diameter design with solder paste surface printing method