NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 60068-2-20 ; VDE 0468-2-20:2022-07 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| DIN EN 60068-2-66 | 1995-06 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) (IEC 60068-2-66:1994); German version EN 60068-2-66:1994 More |
| DIN EN 60068-2-69 ; VDE 0468-2-69:2020-03 | 2020-03 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017 + COR1:2018 + A1:2019); German version EN 60068-2-69:2017 + AC:2018 + A1:2019 More |
| DIN EN 60068-2-78 ; VDE 0468-2-78:2014-02 | 2014-02 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state (IEC 60068-2-78:2012); German version EN 60068-2-78:2013 More |
| DIN EN 61191-3 | 2018-05 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017 More |
| DIN EN 61191-4 | 2018-05 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017 More |
| IEC 60068-2-58 | 2015-03 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60068-2-69 | 2017-03 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method More |
| IEC 60194-2 | 2017-12 | Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies More |
| IEC 61190-1-3 | 2017-12 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non- fluxed solid solder for electronic soldering applications More |
