NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62326-4 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| DIN EN 61249-5-1 | 1996-06 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings; section 1: Copper foils (for the manufacturer of copper-clad base materials) (IEC 61249-5-1:1995); German version EN 61249-5-1:1996 More |
| DIN EN 62326-4-1 | 1997-08 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections; sectional specification; section 1: Capability detail specification; performance levels A, B and C (IEC 62326-4-1:1996); German version EN 62326-4-1:1997 More |
| EN 61249-5-1 | 1996-01 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacturer of copper-clad base materials) (IEC 61249-5-1:1995) More |
| EN 62326-1 | 1997-01 | Printed boards - Part 1: Generic specification (IEC 62326-1:1996) More |
| EN 62326-4-1 | 1997-01 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C (IEC 62326-4-1:1996) More |
| IEC 52/627/FDIS ; IEC 61189-3:1996-10 ; IEC-PN 52/1189-3:1996-10 | 1996-10 | IEC 1189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) More |
| IEC 60068-2-20 | 1979 | Environmental testing. Part 2: Tests. Test T: Soldering More |
| IEC 60068-2-3 | 1969 | Basic environmental testing procedures. Part 2 : Tests. Test Ca: Damp heat, steady state More |
| IEC 60068-2-38 | 1974 | Environmental testing. Part 2: Tests. Test Z/AD: Composite temperature/humidity cyclic test More |
| IEC 61249-5-1 | 1995-11 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) More |
