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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Draft standard [Withdrawn]

IEC 52/627/FDIS ; IEC 61189-3:1996-10 ; IEC-PN 52/1189-3:1996-10
IEC 1189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Edition 1996-10

Original language English , French

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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

IEC 52/627/FDIS ; IEC 61189-3:1996-10 ; IEC-PN 52/1189-3:1996-10 IEC 1189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

IEC 52/627/FDIS ; IEC 61189-3:1996-10 ; IEC-PN 52/1189-3:1996-10
IEC 1189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)