NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61191-1 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61191-4 | 1998-08 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies More |
| IEC 61249-8-8 | 1997-06 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings More |
| IEC 61340-5-1 | 2007-08 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements More |
| IEC 61760-2 | 2007-04 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide More |
| IEC/TR 61340-5-2 | 2007-08 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide More |
| IEC 60068-2-20 | 2008-07 | Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads More |
| IEC 60068-2-58 | 2004-07 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 61188-5-1 | 2002-07 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations; Generic requirements More |
| IEC 61188-5-2 | 2003-06 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations; Discrete components More |
| IEC 61188-5-3 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides More |
