NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Tape Ball Grid Array package, 0.6 mm ball diameter family (Intended for inclusion in 60191-2)
Begin
1998-02-06
Planned document number
IEC 47D/314/CD
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
