DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Thermography test method for defects circuit interconnection defects
Abstract
This document specifies the principles, test conditions, instruments and equipment, reagents and materials, test procedures, and requirements for test reports of thermal imaging testing methods. This document is applicable to the defect location of Circuit boards with interconnect failure after conductive anodic filaments test (CAF), high accelerated temperature and humidity stress test (HAST), interconnect stress test (IST), and thermal shock test (TCT). Other Circuit boards and assembly components with interconnect failure can also refer to it.
Begin
2026-09-25
Planned document number
DIN EN IEC 63761
Project number
02234171
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
