DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Materials for printed boards and other interconnecting structures - Part 2-56: Reinforced base materials clad and unclad - Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate
Abstract
This part of IEC 61249 gives requirements for properties of nonhalogenated epoxide modified bismaleimide/triazine with filler, woven E-glass reinforced laminated sheets of low thermal expansion (less than 50 % of that of typical FR-4) and defined flammability (vertical burning test), copper-clad in thicknesses of 0,02 mm up to 1.60 mm for IC substrate. The flammability rating is achieved with non-halogenated inorganic and/or organic compounds acting as fire retardants. These fire retardants are contained as part of polymeric structure or in addition to it. The low thermal expansion can be achieved using filler. The glass transition temperature is defined to be 170°C minimum.
Begin
2026-08-12
Planned document number
DIN EN IEC 61249-2-56
Project number
02234078
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
