• Hydrogen Technologies Standards form the basic framework for market ramp-up

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Publications of IEC/TC 91

DIN EN 61188-5-2 2004-05 Standards Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003 More  Order from DIN Media
DIN EN 61188-5-3 2008-07 Standards Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007); German version EN 61188-5-3:2007 More  Order from DIN Media
DIN EN 61188-5-4 2008-07 Standards Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007 More  Order from DIN Media
DIN EN 61188-5-5 2008-07 Standards Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 61188-5-5:2007); German version EN 61188-5-5:2007 More  Order from DIN Media
DIN EN 61188-5-6 2003-10 Standards Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides (IEC 61188-5-6:2003); German version EN 61188-5-6:2003 More  Order from DIN Media
DIN EN 61188-5-8 2008-07 Standards Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008 More  Order from DIN Media
DIN EN 61189-2 2007-01 Standards Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006); German version EN 61189-2:2006 More  Order from DIN Media
DIN EN 61189-3 2008-06 Standards Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008 More  Order from DIN Media
DIN EN 61189-5 2007-05 Standards Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006); German version EN 61189-5:2006 More  Order from DIN Media
DIN EN 61189-6 2007-03 Standards Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006); German version EN 61189-6:2006 More  Order from DIN Media

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