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Standards [CURRENT]

DIN EN 61189-3
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008

Title (German)

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten) (IEC 61189-3:2007); Deutsche Fassung EN 61189-3:2008

Document: references other documents

Document: referenced in other documents

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

Responsible international committee

IEC/TC 91 - Electronics assembly technology

Edition 2008-06

Original language German

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Table of contents

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