Norm-Entwurf

PR NF C93-733-302 ; PR NF EN IEC 61189-3-302
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302 : detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Titel (englisch)

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302 : detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Originalsprache Englisch , Französisch
Preis ab 96,80 €
Inhaltsverzeichnis