Norm-Entwurf
PR NF C93-733-302
; PR NF EN IEC 61189-3-302
PR NF C93-733-302
; PR NF EN IEC 61189-3-302
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302 : detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Titel (englisch)
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302 : detection of plating defects in unpopulated circuit boards by computed tomography (CT)