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IEC 91/807/NP 2008-08-29 Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz) Mehr  Kontakt zu DIN 
IEC 38/379A/CDV 2008-08-22 Messwandler - Teil 5: Besondere Anforderungen für kapazitive Spannungswandler - Produktnorm Mehr  Kontakt zu DIN 
IEC 100/1415A/NP 2008-08-22 Comments received on 100/1415/NP: "Multimedia systems and equipment - Multimedia home network configuration - Basic reference model" (TA9) Mehr  Kontakt zu DIN 
IEC ISO 80601-2-56 2008-08-22 ISO 80601-2-56 Ed.1: Medical electrical equipment - Part 2-56: Particular requirements for basic safety and essential performance of clinical thermometers for body temperature measurement Mehr  Kontakt zu DIN 
IEC 47F/4/NP 2008-08-22 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Future IEC 62047-10) Mehr  Kontakt zu DIN 
IEC 47F/5/NP 2008-08-22 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (Future IEC 62047-11) Mehr  Kontakt zu DIN 
IEC 77A/662/CD 2008-08-22 IEC 61000-3-5 Ed.2: Electromagnetic compatibility (EMC) - Part 3: Limits - Section 5: Limitation of voltage fluctuations and flicker in low-voltage power supply systems for equipment with rated current greater than 75 A Mehr  Kontakt zu DIN 
IEC 100/1444/DC 2008-08-22 Stage 0 project on identification and classification of resources Mehr  Kontakt zu DIN 
IEC 13/1434A/NP 2008-08-22 Comment received on 13/1434/NP: "Electricity metering - Payment systems - Part 32: Particular Requirements for Multi-Part Payment Metering Installations (Proposed Technical Specification 62055-32)" Mehr  Kontakt zu DIN 
IEC 47/1987/DC 2008-08-22 Maintenance of IEC 60747-1 Ed. 2.0: Semiconductor devices - Part 1: General Mehr  Kontakt zu DIN 

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