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DKE Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE

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IEC 34B/1412/CD 2008-09-05 IEC 60061: Lamp caps and holders together with gauges for the control of interchangeability and safety Part 1: Lamp caps Part 2: Lampholders Part 3: Gauges Proposal for introduction of new G28d fits Mehr  Kontakt zu DIN 
IEC 86A/1373/CD 2008-09-05 IEC 60794-4-20 Ed. 1.0: Optical fibre cables -- Part 4-20: Aerial optical cables along electrical power lines - Family specification for ADSS (All Dielectric Self Supported) Optical cables Mehr  Kontakt zu DIN 
IEC 108/307/DC 2008-07-18 Draft Strategic Policy Statement Mehr  Kontakt zu DIN 
IEC 91/804/DC 2008-08-29 Review of 91/761/DC: "How to advance the PT 62468 document" Mehr  Kontakt zu DIN 
IEC 62D/894/FDIS 2008-08-29 ISO 80601-2-61 Ed.1: Medical electrical equipment - Part 2-61: Particular requirements for the basic safety and essential performance of pulse oximeter equipment Mehr  Kontakt zu DIN 
IEC 108/311A/DC 2008-08-29 Proposal from TC108/HBSDT to modify IEC 62368, Annex M, by adding requirements for the use of lithium-ion batteries Mehr  Kontakt zu DIN 
IEC 34A/1296/DC 2008-08-29 Proposal to amend IEC 60081: Double-capped fluorescent lamps - Performance specifications Mehr  Kontakt zu DIN 
IEC 15/515/CDV 2008-08-29 IEC 60674-3-8 Ed. 1.0: Specification for plastic films for electrical purposes - Part 3: Specifications for individual materials - Sheet 8: Requirements for balanced biaxially oriented polyethylenenaphthalate (PEN) films used for electrical insulation Mehr  Kontakt zu DIN 
IEC 91/805/NP 2008-08-29 Future IEC 61189-2-628 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis (DMA; bend and pull) Mehr  Kontakt zu DIN 
IEC 91/806/NP 2008-08-29 Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-716: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz) Mehr  Kontakt zu DIN 

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