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NA 022

DKE Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE

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Projekte von NA 022

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IEC 49/930/CDV 2009-10-30 IEC 61837-1 Ed.2: Surface mounted piezoelectric devices for frequency control and selection - Standard outline and terminal lead connections - Part 1: Plastic moulded enclosure outlines Mehr  Kontakt zu DIN 
IEC 47F/70/CDV 2009-10-30 IEC 62047-14 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials Mehr  Kontakt zu DIN 
IEC 57/1232/CDV 2009-10-30 IEC 62325-301 Ed.1: Framework for energy market communications - Part 301: Common Information Model (CIM) extensions for markets Mehr  Kontakt zu DIN 
IEC 57/1373/FDIS 2009-10-30 IEC 62325-351 Ed.1: Framework for energy market communications - Part 351: CIM European market model exchange profile Mehr  Kontakt zu DIN 
IEC 57/1113/CD 2009-10-30 IEC 62325-450 Ed.1: Framework for energy market communications - Part 450: Profile and context modelling rules Mehr  Kontakt zu DIN 
IEC 57/1267/CDV 2009-10-30 IEC 62325-451-1 Ed.1: Framework for energy market communications - Part 451-1: Acknowledgement business process and contextual model for CIM European market Mehr  Kontakt zu DIN 
IEC 64/1707/DC 2009-10-30 Call for comments on the maintenance of IEC 61200-52, 1993: Electrical installation guide - Part 52: Selection and erection of electrical equipment - Wiring systems Mehr  Kontakt zu DIN 
IEC 64/1708/DC 2009-10-30 Modification of the INTRODUCTION common to all Part 7XX of IEC 60364 Mehr  Kontakt zu DIN 
IEC 47F/38/NP 2009-10-30 (Future IEC 62047-15): Semiconductor devices -Micro-electromechanical devices - Part 15: Test method for bond strength in PDMS/Glass chip Mehr  Kontakt zu DIN 
IEC 47F/39/NP 2009-10-30 (Future IEC 62047-16): Semiconductor devices -Micro-electromechanical devices - Part 16: Test method forresidual stress measurement Mehr  Kontakt zu DIN 

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